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MINSAMA LLC Introduces the L3849 Diamond Insert—A Quantum Leap in Thermal Management for Electronics
The L3849 diamond wafer exhibits thermal conductivity more than 6.5 times that of copper, providing significant improvement in managing the heat generated by electronic components.
Thermal images provided highlight the stark contrast in thermal management with the L3849 plate, showing a clear before and after image - from high-intensity heat signatures to cool and stable thermal conditions.
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